ThinkRF
RF Spectrum Analysis
ThinkRF asked us to design a new housing for their key product, used to perform real-time spectrum analysis. The new housing had to be fanless, lightweight, and adaptable for multiple versions. Further, our challenge was to create an iconic design that provided ThinkRF with a new brand identity.
Conceptual Direction
Heat dissipation was a critical technological hurdle to overcome and so our solutions centered on heat sinks as the primary design feature. The concepts explored a range of manufacturing solutions inline with low-run quantities including diecasting, extrusion, CNC machining, and bent sheet metal.
Design Definition
We carried our design from initial concept through manufacturing. Further, we provided full 2D documentation for the complete line of models. Each engineering drawing package documented a detailed bill-of-materials, revision control, critical assembly details, CMF, and general dimensioning and tolerances (GD&T).